PCB Manufacturing

1

Layers

Single Sided,2 to 18 Layer

 2

Board material type

FR4,CEM-1,CEM-3,ceramic substrate board,

aluminum based board, high-Tg, Rogers and more

 3

Compound material lamination

4 to 6 layers

 4

Maximum dimension

610 x 1,100mm

 5

Dimension tolerance

±0.13mm

 6

Board thickness coverage

0.2 to 6.00mm

 7

Board thickness tolerance

±10%

 8

DK thickness

0.076 to 6.00mm

 9

Minimum line width

0.10mm

10

Minimum line space

0.10mm

11

Outer layer copper thickness

8.75 to 175µm

12

Inner layer copper thickness

17.5 to 175µm

13

Drilling hole diameter (mechanical drill)

0.25 to 6.00mm

14

Finished hole diameter (mechanical drill)

0.20 to 6.00mm

15

Hole diameter tolerance (mechanical drill)

0.05mm

16

Hole position tolerance (mechanical drill)

0.075mm

17

Laser drill hole size

0.10mm

18

Board thickness and hole diameter ratio

10:1

19

Solder mask type

Green, Yellow, Black, Purple, Blue, White and Red

20

Minimum solder mask

Ø0.10mm

21

Minimum size of solder mask separation ring

0.05mm

22

Solder mask oil plug hole diameter

0.25 to 0.60mm

23

Impedance control tolerance

±10%

24

Surface finish

Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger